World News: 14:32 GMT Friday 10th August 2018. [Research and Markets via Businesswire via SPi World News]
The "Global Thin Wafer Processing and Dicing Equipment Market - Segmented by Equipment Type (Processing and Dicing), Technology (Grinding, Grinding and CPM, Blade Dicing, Laser Ablation), Application and Region - Growth, Trends & Forecast (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.
The thin wafer processing and dicing equipment market is expected to grow at a CAGR of over 6% during the forecast period (2018-2023).
Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production.
Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface. With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period.
Developments in the Market
Key Topics Covered
2. Executive Summary
3. Market Overview
4. Market Dynamics
5. Global Thin Wafer Processing and Dicing Equipment Market Segmentation
6. Company Profiles
7. Investment Analysis
8. Future of Global Thin Wafer Processing and Dicing Equipment Market
For more information about this report visit https://www.researchandmarkets.com/research/vwqwm7/global_thin_wafer?w=4
Business Wire: 14:32 GMT Friday 10th August 2018
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