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eSilicon to present Mastering SI/PI for Advanced Package Design at the ANSYS Innovation Conference, Santa Clara, California SAN JOSE, Calif., July 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging soluti...... 13:00 GMT Thursday 26th July 2018

22 Students graduate eSilicon’s FAST Academy work-study program BUCHAREST, Romania, July 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions,...... 06:00 GMT Tuesday 24th July 2018

7nm networking platform delivers unprecedented performance and configurability for data center ASICs SAN JOSE, Calif., June 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, ...... 13:00 GMT Tuesday 26th June 2018

eSilicon at DAC: eSilicon announces new networking platform SAN JOSE, Calif., June 19, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, will participate a...... 13:00 GMT Tuesday 19th June 2018

eSilicon revolutionizes machine learning ASIC platform (MLAP) market SANTA CLARA, Calif., June 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, announced today...... 13:30 GMT Tuesday 5th June 2018

eSilicon deep learning ASIC in production qualification SAN JOSE, Calif., May 01, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, today announced tha...... 13:00 GMT Tuesday 1st May 2018

eSilicon awards seven scholarships to top female STEM students in Vietnam SAN JOSE, Calif. and HO CHI MINH CITY, Vietnam, April 04, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging...... 23:00 GMT Wednesday 4th April 2018

eSilicon to present: Enabling Technology for the Cloud and AI – One Size Fits All? SAN JOSE, Calif., March 27, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, will present at De...... 10:30 GMT Tuesday 27th March 2018

TIRIAS Research Publishes White Paper on ASIC Market ...... 13:00 GMT Tuesday 23rd January 2018

eSilicon to present on HBM/2.5D at SemIsrael Expo 2017 ...... 05:00 GMT Wednesday 22nd November 2017

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