Global High Density Interconnect (HDI) Printed Circuit Board (PCB) Market to Witness a CAGR of 12.8% During 2019-2025

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NEW YORK, May 15, 2019 (GLOBE NEWSWIRE) -- The is anticipated to reach by 2025, while augmenting at a . The market growth is attributed to the increasing miniaturization of electronic devices, rapid inclination of consumers towards smart devices, and significant growth in consumer electronics as well as increasing adoption of safety measures in automobile. Additionally, increasing adoption of smart wearables is also likely to fuel the demand for high density interconnects PCBs over the forecast period. However, the high cost coupled with lack of expertise in manufacturing HDI printed circuit board is expected to impede the market growth to during 2019-2025.

High density interconnect PCB is an evolution in printed circuit board manufacturing technology that assists in fabricating higher circuit density than conventional PCBs. HDI printed circuit board offers an ability to place more components on both sides of the PCBs, which significantly results in faster signal transmission speed and reduction in signal loss. Moreover, it provides faster routing, minimize the frequent relocation of components, and utilize less space. Furthermore, it designs to reduce size as well as improves electrical performance of embedded devices.

The substantial increase in the sales of consumer electronics along with the growing demand for high density printed circuit boards in many end-use applications is likely to foster the market growth. Additionally, lightweight and high performance of HDI printed circuit boards is making them suitable for powering wearable devices. Besides, HDI printed circuit board utilizes a combination of advanced features such as blind vias, and microvias among others to maximize the space of the board while increasing its performance and functionality. Furthermore, increasing trend towards autonomous driving and sophisticated safety systems is creating more opportunity for the demand over the forecast period.

Geographically, the global HDI printed circuit boards market is segmented into North America, Asia-Pacific, Europe, Middle East and Africa, and Central & South America. North America is accounted to hold the largest market share in 2018, owing to increased adoption of smart wearables coupled with rising demand for HDI printed circuit boards from automotive sector. However, Asia-Pacific is likely to emerge as the fastest growing region in the HDI printed circuit board market, and anticipated to dominate the market during 2019-2025. The presence of major electronics and semiconductor manufacturers and rapid expansion of telecommunication network in emerging economies is estimated to augment the market growth during the forecast period.

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Globe Newswire: 13:29 GMT Wednesday 15th May 2019

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