World News: 13:00 GMT Thursday 30th May 2019. [Teledyne DALSA via Globe Newswire via SPi World News]
WATERLOO, Ontario, May 30, 2019 (GLOBE NEWSWIRE) -- Teledyne DALSA, a Teledyne Technologies (NYSE: TDY) company and global leader in machine vision technology, is pleased to announce its new series, a CoaXPress line of CMOS area scan cameras that redefine performance and feature the latest On-Semiconductor and E2V sensors.
These newest industry leading image CMOS sensors range from 16 to 67 megapixel resolution with added and proven CoaXPress 6.25 Gbps technology offering breakthrough speed, robust build quality for wide operating temperature, and an unmatched feature set at an incredible price. Perfectly complemented by the half-length frame grabber, they have been designed to work synergistically, minimizing CPU usage and improving processing times for host applications by enabling maximum sustained throughput and ready-to-use image data.
Offering 25 million pixels at 80 fps in a small form factor, these new Genie Nano-CXP cameras are engineered to deliver high-speed, dependable results for applications such as semiconductor wafer inspection, electronics manufacturing, solar panel inspection, and machine vision.
For more information about the Genie Nano-CXP models visit the website. For high quality images, please visit our .
A photo accompanying this announcement is available at
Globe Newswire: 13:00 GMT Thursday 30th May 2019
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