World News: 16:10 GMT Friday 12th July 2019. [Research and Markets via Globe Newswire via SPi World News]
Dublin, July 12, 2019 (GLOBE NEWSWIRE) -- The report has been added to offering. The 3D TSV devices market is expected to register a CAGR of 6.2% over the forecast period of 2019-2024.For saving space in the package, next-generation products are intended to meet the demand from edge computing applications, which require shorter reaction time and different structures using silicon via (TSV) techniques for chip stacking, which will come as a new trend for the market.
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Related Topics: Semiconductor
Globe Newswire: 16:10 GMT Friday 12th July 2019
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